Microsoft Corporation
THERMALLY CONDUCTIVE MICROTUBES FOR EVENLY DISTRIBUTING HEAT FLUX ON A COOLING SYSTEM
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Abstract:
An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.
Status:
Application
Type:
Utility
Filling date:
1 Feb 2021
Issue date:
4 Aug 2022