Onto Innovation Inc.
LASER TRIANGULATION SENSOR SYSTEM AND METHOD FOR WAFER INSPECTION

Last updated:

Abstract:

Systems and methods for measuring a dimension of a 3D structure of a semiconductor device, such as height of a pad or bump supported by a film layer. The methods can include obtaining raw data implicating a height of the 3D structure with a laser triangulation sensor and adjusting the raw data with a compensation factor that accounts for effects of the film layer and a thickness of the film layer.

Status:
Application
Type:

Utility

Filling date:

6 Nov 2018

Issue date:

12 Nov 2020