Onto Innovation Inc.
LASER TRIANGULATION SENSOR SYSTEM AND METHOD FOR WAFER INSPECTION
Last updated:
Abstract:
Systems and methods for measuring a dimension of a 3D structure of a semiconductor device, such as height of a pad or bump supported by a film layer. The methods can include obtaining raw data implicating a height of the 3D structure with a laser triangulation sensor and adjusting the raw data with a compensation factor that accounts for effects of the film layer and a thickness of the film layer.
Status:
Application
Type:
Utility
Filling date:
6 Nov 2018
Issue date:
12 Nov 2020