PDF Solutions, Inc.
Wafer Bin Map Based Root Cause Analysis

Last updated:

Abstract:

A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.

Status:
Application
Type:

Utility

Filling date:

30 Apr 2021

Issue date:

4 Nov 2021