PDF Solutions, Inc.
Pattern-Enhanced Spatial Correlation of Test Structures to Die Level Responses

Last updated:

Abstract:

Enhancement of less dominant patterns for parametric wafer measurements. Dominant patterns are removed from the parametric pattern thereby revealing a less dominant pattern. The less dominant patterns can be used to identify root causes for yield loss that are not visible in the original parametric measurements.

Status:
Application
Type:

Utility

Filling date:

6 Aug 2021

Issue date:

10 Feb 2022