PDF Solutions, Inc.
Pattern-Enhanced Spatial Correlation of Test Structures to Die Level Responses
Last updated:
Abstract:
Enhancement of less dominant patterns for parametric wafer measurements. Dominant patterns are removed from the parametric pattern thereby revealing a less dominant pattern. The less dominant patterns can be used to identify root causes for yield loss that are not visible in the original parametric measurements.
Status:
Application
Type:
Utility
Filling date:
6 Aug 2021
Issue date:
10 Feb 2022