PDF Solutions, Inc.
Sequenced Approach For Determining Wafer Path Quality

Last updated:

Abstract:

Wafer quality is determined by modeling equipment history as a sequence of events, then evaluating anomalous results for individual events. Identifying an event that generates bad wafers narrows the list of possible root causes.

Status:
Application
Type:

Utility

Filling date:

27 Aug 2021

Issue date:

3 Mar 2022