PDF Solutions, Inc.
Sequenced Approach For Determining Wafer Path Quality
Last updated:
Abstract:
Wafer quality is determined by modeling equipment history as a sequence of events, then evaluating anomalous results for individual events. Identifying an event that generates bad wafers narrows the list of possible root causes.
Status:
Application
Type:
Utility
Filling date:
27 Aug 2021
Issue date:
3 Mar 2022