PDF Solutions, Inc.
DIE LEVEL PRODUCT MODELING WITHOUT DIE LEVEL INPUT DATA
Last updated:
Abstract:
A machine learning model for each die for imputing process control parameters at the die. The model is based on wafer sort parametric measurements at multiple test sites across the entire wafer, as well as yield results for the wafer. This allows for a better analysis of outlier spatial patterns leading to improved yield results.
Status:
Application
Type:
Utility
Filling date:
16 Oct 2020
Issue date:
22 Apr 2021