PDF Solutions, Inc.
Failure detection for wire bonding in semiconductors

Abstract:

Disclosed is a system and method for collecting trace data of integrated circuits from the back-end assembly tools and using yield, reliability, and burn-in data to distinguish good circuit traces from bad ones. Described further is an system and method for implementing a heuristic mapping of trace data for distinguishing between good or bad traces in an Internet-based or offline application. The result of this detection can then be used for yield improvement or for burn-in reduction where for example burn-in chips having "good" circuit traces are subjected to thermal stress for less time than for chips identified as having "bad" circuit traces.