PDF Solutions, Inc.
Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells
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Abstract:
Improved processes for manufacturing wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements ("NCEM") of fill cells that contain structures configured target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes. Such processes may involve evaluating Designs of Experiments ("DOEs"), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).
Status:
Grant
Type:
Utility
Filling date:
4 Apr 2016
Issue date:
17 Mar 2020