TTM Technologies, Inc.
HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY

Abstract:

An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component may include a first dielectric layer having a top and a bottom, and a first conductive trace positioned on the bottom of the first dielectric layer. The component may also include a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace and a first solder layer connecting the first conductive trace to a second conductive trace of the printed circuit board and extending the full length of the first conductive trace. The component may also include a third conductive trace over the top of the first dielectric layer. The component may also include a pad under the first dielectric layer. The pad is soldered to a signal contact region of the printed circuit board. The third conductive trace is coupled to signal outputs formed by the signal contact region of the printed circuit board through a first via. The component may also include a second solder layer connecting the first ground layer of the component to a second ground layer positioned on the printed circuit board.