TTM Technologies
Patents, Design & Utilities
Last updated:
List of all TTM Technologies patents 19 in total
| Status | Patent |
|---|---|
Application | Utility: HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY Filling date: 6 Sep 2025 Issue date: 4 Aug 2022 |
Application | Utility: NEAR-HERMETIC PACKAGE WITH FLEXIBLE SIGNAL INPUT AND OUTPUT Filling date: 6 Sep 2025 Issue date: 4 Aug 2022 |
Grant | Utility: Wideband termination for high power applications Filling date: 6 Sep 2025 Issue date: 2 Aug 2022 |
Grant | Utility: Directional couplers with DC insulated input and output ports Filling date: 6 Sep 2025 Issue date: 14 Jun 2022 |
Application | Utility: DEVICES AND METHODS FOR FORMING ENGINEERED THERMAL PATHS OF PRINTED CIRCUIT BOARDS BY USE OF REMOVABLE LAYERS Filling date: 6 Sep 2025 Issue date: 9 Jun 2022 |
Grant | Utility: Three-dimensional circuit assembly with composite bonded encapsulation Filling date: 6 Sep 2025 Issue date: 15 Mar 2022 |
Application | Utility: SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM PRINTED CIRCUIT BOARDS Filling date: 6 Sep 2025 Issue date: 17 Feb 2022 |
Application | Utility: HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY Filling date: 6 Sep 2025 Issue date: 27 Jan 2022 |
Grant | Utility: High powered RF part for improved manufacturability Filling date: 6 Sep 2025 Issue date: 26 Oct 2021 |
Application | Utility: VACUUM NOZZLE ASSEMBLY FOR VACUUM-ASSISTED DRIVER Filling date: 6 Sep 2025 Issue date: 9 Sep 2021 |
Application | Utility: DIRECTIONAL COUPLERS WITH DC INSULATED INPUT AND OUTPUT PORTS Filling date: 6 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: HIGH-DENSITY OPTICAL WAVEGUIDE STRUCTURE AND PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 12 Aug 2021 |
Application | Utility: METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH DENSITY VIA ARRAY Filling date: 6 Sep 2025 Issue date: 22 Jul 2021 |
Application | Utility: SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM PRINTED CIRCUIT BOARDS Filling date: 6 Sep 2025 Issue date: 6 May 2021 |
Application | Utility: WIDEBAND TERMINATION FOR HIGH POWER APPLICATIONS Filling date: 6 Sep 2025 Issue date: 29 Apr 2021 |
Grant | Utility: Methods for fabricating printed circuit board assemblies with high density via array Filling date: 6 Sep 2025 Issue date: 13 Apr 2021 |
Application | Utility: THREE-DIMENSIONAL CIRCUIT ASSEMBLY WITH COMPOSITE BONDED ENCAPSULATION Filling date: 6 Sep 2025 Issue date: 4 Mar 2021 |
Application | Utility: METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH DENSITY VIA ARRAY Filling date: 6 Sep 2025 Issue date: 10 Sep 2020 |
Grant | Utility: Wideband termination for high power applications Filling date: 6 Sep 2025 Issue date: 8 Sep 2020 |
Showing 1 to 19 of 19 patents.