Amkor Technology
Utility Patent Applications
Last updated:
List of all Amkor Technology patents 71 in total
| Status | Patent |
|---|---|
Application | Utility: SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 2 Jan 2020 |
Application | Utility: ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 26 Dec 2019 |
Application | Utility: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Filling date: 7 Sep 2025 Issue date: 5 Dec 2019 |
Application | Utility: SHIELDED ELECTRONIC COMPONENT PACKAGE Filling date: 7 Sep 2025 Issue date: 5 Dec 2019 |
Application | Utility: METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES Filling date: 7 Sep 2025 Issue date: 5 Dec 2019 |
Application | Utility: THIN BONDED INTERPOSER PACKAGE Filling date: 7 Sep 2025 Issue date: 14 Nov 2019 |
Application | Utility: STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE Filling date: 7 Sep 2025 Issue date: 7 Nov 2019 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 24 Oct 2019 |
Application | Utility: SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 24 Oct 2019 |
Application | Utility: SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS Filling date: 7 Sep 2025 Issue date: 17 Oct 2019 |
Application | Utility: SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS Filling date: 7 Sep 2025 Issue date: 10 Oct 2019 |
Application | Utility: Method of Manufacturing a Package-on-Package Type Semiconductor Package Filling date: 7 Sep 2025 Issue date: 10 Oct 2019 |
Application | Utility: EMBEDDED BALL LAND SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHODS Filling date: 7 Sep 2025 Issue date: 3 Oct 2019 |
Application | Utility: ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 3 Oct 2019 |
Application | Utility: ENCAPSULATED SEMICONDUCTOR PACKAGE Filling date: 7 Sep 2025 Issue date: 19 Sep 2019 |
Application | Utility: SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE Filling date: 7 Sep 2025 Issue date: 19 Sep 2019 |
Application | Utility: ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 12 Sep 2019 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 12 Sep 2019 |
Application | Utility: SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS Filling date: 7 Sep 2025 Issue date: 12 Sep 2019 |
Application | Utility: METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRONIC COMPONENT WITH AN ON-EDGE ORIENTATION AND RELATED STRUCTURES Filling date: 7 Sep 2025 Issue date: 29 Aug 2019 |
Application | Utility: SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD THEREOF Filling date: 7 Sep 2025 Issue date: 1 Aug 2019 |
Showing 50 to 71 of 71 patents.