| Utility: Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate Filling date: 7 Sep 2025 Issue date: 30 Aug 2022 | 1 Oct 2018 | 30 Aug 2022 |
| Utility: Semiconductor device and method of manufacturing semiconductor device Filling date: 7 Sep 2025 Issue date: 7 Jun 2022 | 21 Jun 2019 | 7 Jun 2022 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 21 Dec 2021 | 28 Aug 2018 | 21 Dec 2021 |
| Utility: Semiconductor package and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 19 Oct 2021 | 23 Jul 2018 | 19 Oct 2021 |
| Utility: Semiconductor devices and methods of manufacturing semiconductor devices Filling date: 7 Sep 2025 Issue date: 1 Jun 2021 | 10 Aug 2019 | 1 Jun 2021 |
| Utility: Land structure for semiconductor package and method therefor Filling date: 7 Sep 2025 Issue date: 25 May 2021 | 28 Nov 2017 | 25 May 2021 |
| Utility: Electronic package structure with improved board level reliability Filling date: 7 Sep 2025 Issue date: 18 May 2021 | 10 Feb 2018 | 18 May 2021 |
| Utility: Semiconductor package and fabricating method thereof Filling date: 7 Sep 2025 Issue date: 9 Mar 2021 | 29 Jan 2019 | 9 Mar 2021 |
| Utility: Semiconductor device having conductive wire with increased attachment angle and method Filling date: 7 Sep 2025 Issue date: 9 Mar 2021 | 18 Oct 2018 | 9 Mar 2021 |
| Utility: Packaged electronic device having integrated antenna and locking structure Filling date: 7 Sep 2025 Issue date: 16 Feb 2021 | 12 Jan 2020 | 16 Feb 2021 |
| Utility: Method of forming a molded substrate electronic package and structure Filling date: 7 Sep 2025 Issue date: 2 Feb 2021 | 3 Feb 2018 | 2 Feb 2021 |
| Utility: Semiconductor package using a coreless signal distribution structure Filling date: 7 Sep 2025 Issue date: 26 Jan 2021 | 29 Aug 2017 | 26 Jan 2021 |
| Utility: Wafer level fan out semiconductor device and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 26 Jan 2021 | 21 Jul 2017 | 26 Jan 2021 |
| Utility: Method of manufacturing a semiconductor device Filling date: 7 Sep 2025 Issue date: 19 Jan 2021 | 12 Jan 2018 | 19 Jan 2021 |
| Utility: Integrated shield package and method Filling date: 7 Sep 2025 Issue date: 5 Jan 2021 | 22 Oct 2018 | 5 Jan 2021 |
| Utility: Method of manufacturing a package-on-package type semiconductor package Filling date: 7 Sep 2025 Issue date: 15 Dec 2020 | 14 May 2019 | 15 Dec 2020 |
| Utility: Method of manufacturing a semiconductor device Filling date: 7 Sep 2025 Issue date: 15 Dec 2020 | 10 Aug 2015 | 15 Dec 2020 |
| Utility: Embedded vibration management system having an array of vibration absorbing structures Filling date: 7 Sep 2025 Issue date: 8 Dec 2020 | 24 Jul 2018 | 8 Dec 2020 |
| Utility: Semiconductor package with multiple compartments Filling date: 7 Sep 2025 Issue date: 24 Nov 2020 | 4 Mar 2019 | 24 Nov 2020 |
| Utility: Method of forming an electronic device structure having an electronic component with an on-edge orientation and related structures Filling date: 7 Sep 2025 Issue date: 24 Nov 2020 | 27 Feb 2018 | 24 Nov 2020 |
| Utility: Electronic device with top side pin array and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 10 Nov 2020 | 28 May 2019 | 10 Nov 2020 |
| Utility: Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure Filling date: 7 Sep 2025 Issue date: 10 Nov 2020 | 30 Jul 2018 | 10 Nov 2020 |
| Utility: Method of forming a packaged semiconductor device having enhanced wettable flank and structure Filling date: 7 Sep 2025 Issue date: 3 Nov 2020 | 4 Jan 2020 | 3 Nov 2020 |
| Utility: Semiconductor package using a polymer substrate Filling date: 7 Sep 2025 Issue date: 3 Nov 2020 | 23 Jan 2019 | 3 Nov 2020 |
| Utility: Thin bonded interposer package Filling date: 7 Sep 2025 Issue date: 27 Oct 2020 | 25 Mar 2019 | 27 Oct 2020 |
| Utility: Embedded ball land substrate, semiconductor package, and manufacturing methods Filling date: 7 Sep 2025 Issue date: 27 Oct 2020 | 2 Apr 2018 | 27 Oct 2020 |
| Utility: Encapsulated semiconductor package Filling date: 7 Sep 2025 Issue date: 20 Oct 2020 | 31 May 2019 | 20 Oct 2020 |
| Utility: Semiconductor device with through-mold via Filling date: 7 Sep 2025 Issue date: 20 Oct 2020 | 2 Jul 2018 | 20 Oct 2020 |
| Utility: Semiconductor device with thin redistribution layers Filling date: 7 Sep 2025 Issue date: 13 Oct 2020 | 23 Apr 2019 | 13 Oct 2020 |
| Utility: Electronic device with adaptive vertical interconnect and fabricating method thereof Filling date: 7 Sep 2025 Issue date: 29 Sep 2020 | 27 Mar 2018 | 29 Sep 2020 |
| Utility: Semiconductor package and fabricating method thereof Filling date: 7 Sep 2025 Issue date: 22 Sep 2020 | 2 Dec 2019 | 22 Sep 2020 |
| Utility: Semiconductor device with optically-transmissive layer and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 22 Sep 2020 | 18 Nov 2019 | 22 Sep 2020 |
| Utility: Wafer-level stack chip package and method of manufacturing the same Filling date: 7 Sep 2025 Issue date: 22 Sep 2020 | 3 Nov 2015 | 22 Sep 2020 |
| Utility: System and method for laser assisted bonding of an electronic device Filling date: 7 Sep 2025 Issue date: 1 Sep 2020 | 28 May 2019 | 1 Sep 2020 |
| Utility: Semiconductor device with tiered pillar and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 18 Aug 2020 | 9 Apr 2019 | 18 Aug 2020 |
| Utility: Method and system for packing optimization of semiconductor devices Filling date: 7 Sep 2025 Issue date: 4 Aug 2020 | 1 May 2018 | 4 Aug 2020 |
| Utility: Semiconductor device package and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 14 Jul 2020 | 6 May 2019 | 14 Jul 2020 |
| Utility: Semiconductor devices and methods of making semiconductor devices Filling date: 7 Sep 2025 Issue date: 14 Jul 2020 | 2 Apr 2019 | 14 Jul 2020 |
| Utility: Semiconductor device with redistribution layers formed utilizing dummy substrates Filling date: 7 Sep 2025 Issue date: 7 Jul 2020 | 1 Aug 2014 | 7 Jul 2020 |
| Utility: Electronic device package and fabricating method thereof Filling date: 7 Sep 2025 Issue date: 23 Jun 2020 | 28 May 2019 | 23 Jun 2020 |
| Utility: Semiconductor package having routable encapsulated conductive substrate and method Filling date: 7 Sep 2025 Issue date: 16 Jun 2020 | 11 Jul 2018 | 16 Jun 2020 |
| Utility: Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 9 Jun 2020 | 10 Feb 2017 | 9 Jun 2020 |
| Utility: Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Filling date: 7 Sep 2025 Issue date: 2 Jun 2020 | 29 Jan 2019 | 2 Jun 2020 |
| Utility: Semiconductor package with high routing density patch Filling date: 7 Sep 2025 Issue date: 2 Jun 2020 | 11 Sep 2018 | 2 Jun 2020 |
| Utility: Sensor package and manufacturing method thereof Filling date: 7 Sep 2025 Issue date: 2 Jun 2020 | 24 May 2018 | 2 Jun 2020 |
| Utility: Semiconductor package using cavity substrate and manufacturing methods Filling date: 7 Sep 2025 Issue date: 2 Jun 2020 | 16 Apr 2018 | 2 Jun 2020 |
| Utility: Wafer level package and fabrication method Filling date: 7 Sep 2025 Issue date: 26 May 2020 | 16 Jan 2018 | 26 May 2020 |
| Utility: Semiconductor device and method of manufacturing a semiconductor device Filling date: 7 Sep 2025 Issue date: 5 May 2020 | 23 Feb 2019 | 5 May 2020 |
| Utility: Packaging for fingerprint sensors and methods of manufacture Filling date: 7 Sep 2025 Issue date: 28 Apr 2020 | 5 Sep 2017 | 28 Apr 2020 |
| Utility: Method of manufacturing an electronic device and electronic device manufactured thereby Filling date: 7 Sep 2025 Issue date: 24 Mar 2020 | 10 Aug 2017 | 24 Mar 2020 |
