Lam Research
Utility Patent Applications
Last updated:
List of all Lam Research patents 177 in total
| Status | Patent |
|---|---|
Application | Utility: INDUCTIVELY COUPLED PLASMA CHAMBER HEATER FOR CONTROLLING DIELECTRIC WINDOW TEMPERATURE Filling date: 13 Sep 2025 Issue date: 30 Sep 2021 |
Application | Utility: RF SIGNAL PARAMETER MEASUREMENT IN AN INTEGRATED CIRCUIT FABRICATION CHAMBER Filling date: 13 Sep 2025 Issue date: 30 Sep 2021 |
Application | Utility: ELECTROSTATIC CHUCK DESIGN FOR COOLING-GAS LIGHT-UP PREVENTION Filling date: 13 Sep 2025 Issue date: 23 Sep 2021 |
Application | Utility: SURFACE COATING FOR PLASMA PROCESSING CHAMBER COMPONENTS Filling date: 13 Sep 2025 Issue date: 23 Sep 2021 |
Application | Utility: INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCH CHAMBER AND IN-SITU ETCH-ALP METHOD Filling date: 13 Sep 2025 Issue date: 16 Sep 2021 |
Application | Utility: ELECTRON EXCITATION ATOMIC LAYER ETCH Filling date: 13 Sep 2025 Issue date: 9 Sep 2021 |
Application | Utility: METHOD FOR CONDITIONING A CERAMIC COATING Filling date: 13 Sep 2025 Issue date: 9 Sep 2021 |
Application | Utility: INTEGRATED SHOWERHEAD WITH IMPROVED HOLE PATTERN FOR DELIVERING RADICAL AND PRECURSOR GAS TO A DOWNSTREAM CHAMBER TO ENABLE REMOTE PLASMA FILM DEPOSITION Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: THERMAL IMAGING FOR WITHIN WAFER VARIABILITY FEEDFORWARD OR FEEDBACK INFORMATION Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: SELECTIVELY ETCHING FOR NANOWIRES Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: DYNAMIC TEMPERATURE CONTROL OF SUBSTRATE SUPPORT IN SUBSTRATE PROCESSING SYSTEM Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: OXIDATIVE CONVERSION IN ATOMIC LAYER DEPOSITION PROCESSES Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: REDUCED FOOTPRINT WAFER HANDLING PLATFORM Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: TIN OXIDE MANDRELS IN PATTERNING Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Application | Utility: TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Application | Utility: TEMPERATURE-TUNED SUBSTRATE SUPPORT FOR SUBSTRATE PROCESSING SYSTEMS Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Application | Utility: METHOD AND APPARATUS FOR PROCESSING WAFERS Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Application | Utility: VACUUM PUMP PROTECTION AGAINST DEPOSITION BYPRODUCT BUILDUP Filling date: 13 Sep 2025 Issue date: 19 Aug 2021 |
Application | Utility: RADIO FREQUENCY (RF) SIGNAL SOURCE SUPPLYING RF PLASMA GENERATOR AND REMOTE PLASMA GENERATOR Filling date: 13 Sep 2025 Issue date: 19 Aug 2021 |
Application | Utility: CLEANING SYSTEM FOR REMOVING DEPOSITS FROM PUMP IN AN EXHAUST OF A SUBSTRATE PROCESSING SYSTEM Filling date: 13 Sep 2025 Issue date: 19 Aug 2021 |
Application | Utility: EFFICIENT CLEANING AND ETCHING OF HIGH ASPECT RATIO STRUCTURES Filling date: 13 Sep 2025 Issue date: 12 Aug 2021 |
Application | Utility: TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING Filling date: 13 Sep 2025 Issue date: 5 Aug 2021 |
Application | Utility: SYMMETRIC PRECURSOR DELIVERY Filling date: 13 Sep 2025 Issue date: 5 Aug 2021 |
Application | Utility: METAL-CONTAINING PASSIVATION FOR HIGH ASPECT RATIO ETCH Filling date: 13 Sep 2025 Issue date: 5 Aug 2021 |
Application | Utility: METHOD OF DEPOSITING TUNGSTEN AND OTHER METALS IN 3D NAND STRUCTURES Filling date: 13 Sep 2025 Issue date: 5 Aug 2021 |
Application | Utility: PREVENTING DEPOSITION ON PEDESTAL IN SEMICONDUCTOR SUBSTRATE PROCESSING Filling date: 13 Sep 2025 Issue date: 29 Jul 2021 |
Application | Utility: CONFIGURABLE DISTRIBUTED-INTERLOCK-SYSTEM Filling date: 13 Sep 2025 Issue date: 29 Jul 2021 |
Showing 150 to 177 of 177 patents.