TTM Technologies
Utility Patent Applications

Last updated:

List of all TTM Technologies patents 13 in total

Status Patent
Application
Utility: HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY External link
Filling date: 7 Sep 2025 Issue date: 4 Aug 2022
Application
Utility: NEAR-HERMETIC PACKAGE WITH FLEXIBLE SIGNAL INPUT AND OUTPUT External link
Filling date: 7 Sep 2025 Issue date: 4 Aug 2022
Application
Utility: DEVICES AND METHODS FOR FORMING ENGINEERED THERMAL PATHS OF PRINTED CIRCUIT BOARDS BY USE OF REMOVABLE LAYERS External link
Filling date: 7 Sep 2025 Issue date: 9 Jun 2022
Application
Utility: SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM PRINTED CIRCUIT BOARDS External link
Filling date: 7 Sep 2025 Issue date: 17 Feb 2022
Application
Utility: HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY External link
Filling date: 7 Sep 2025 Issue date: 27 Jan 2022
Application
Utility: VACUUM NOZZLE ASSEMBLY FOR VACUUM-ASSISTED DRIVER External link
Filling date: 7 Sep 2025 Issue date: 9 Sep 2021
Application
Utility: DIRECTIONAL COUPLERS WITH DC INSULATED INPUT AND OUTPUT PORTS External link
Filling date: 7 Sep 2025 Issue date: 2 Sep 2021
Application
Utility: HIGH-DENSITY OPTICAL WAVEGUIDE STRUCTURE AND PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF External link
Filling date: 7 Sep 2025 Issue date: 12 Aug 2021
Application
Utility: METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH DENSITY VIA ARRAY External link
Filling date: 7 Sep 2025 Issue date: 22 Jul 2021
Application
Utility: SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM PRINTED CIRCUIT BOARDS External link
Filling date: 7 Sep 2025 Issue date: 6 May 2021
Application
Utility: WIDEBAND TERMINATION FOR HIGH POWER APPLICATIONS External link
Filling date: 7 Sep 2025 Issue date: 29 Apr 2021
Application
Utility: THREE-DIMENSIONAL CIRCUIT ASSEMBLY WITH COMPOSITE BONDED ENCAPSULATION External link
Filling date: 7 Sep 2025 Issue date: 4 Mar 2021
Application
Utility: METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH DENSITY VIA ARRAY External link
Filling date: 7 Sep 2025 Issue date: 10 Sep 2020

Showing 1 to 13 of 13 patents.