| Utility: Deposition of self assembled monolayer for enabling selective deposition and etch Filling date: 6 Sep 2025 Issue date: 20 Sep 2022 | 25 Jun 2020 | 20 Sep 2022 |
| Utility: Alternative integration for redistribution layer process Filling date: 6 Sep 2025 Issue date: 20 Sep 2022 | 26 Jul 2019 | 20 Sep 2022 |
| Utility: Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials Filling date: 6 Sep 2025 Issue date: 20 Sep 2022 | 15 Mar 2019 | 20 Sep 2022 |
| Utility: PECVD deposition system for deposition on selective side of the substrate Filling date: 6 Sep 2025 Issue date: 13 Sep 2022 | 16 Dec 2021 | 13 Sep 2022 |
| Utility: Planar substrate edge contact with open volume equalization pathways and side containment Filling date: 6 Sep 2025 Issue date: 13 Sep 2022 | 31 Mar 2020 | 13 Sep 2022 |
| Utility: Frequency tuning for a matchless plasma source Filling date: 6 Sep 2025 Issue date: 6 Sep 2022 | 27 May 2020 | 6 Sep 2022 |
| Utility: Substrate processing system with tandem source activation for CVD Filling date: 6 Sep 2025 Issue date: 6 Sep 2022 | 2 Mar 2020 | 6 Sep 2022 |
| Utility: Manifold valve for multiple precursors Filling date: 6 Sep 2025 Issue date: 30 Aug 2022 | 30 Jan 2019 | 30 Aug 2022 |
| Utility: Two-stage pin lifter for de-chuck operations Filling date: 6 Sep 2025 Issue date: 30 Aug 2022 | 4 Sep 2018 | 30 Aug 2022 |
| Utility: Software emulator for hardware components in a gas delivery system of substrate processing system Filling date: 6 Sep 2025 Issue date: 30 Aug 2022 | 4 Sep 2018 | 30 Aug 2022 |
| Utility: Metal liner passivation and adhesion enhancement by zinc doping Filling date: 6 Sep 2025 Issue date: 23 Aug 2022 | 4 Aug 2020 | 23 Aug 2022 |
| Utility: Control of on-wafer cd uniformity with movable edge ring and gas injection adjustment Filling date: 6 Sep 2025 Issue date: 23 Aug 2022 | 13 Aug 2019 | 23 Aug 2022 |
| Utility: Distance measurement between gas distribution device and substrate support at high temperatures Filling date: 6 Sep 2025 Issue date: 9 Aug 2022 | 3 Jan 2019 | 9 Aug 2022 |
| Utility: Controlling plating electrolyte concentration on an electrochemical plating apparatus Filling date: 6 Sep 2025 Issue date: 2 Aug 2022 | 11 Jan 2021 | 2 Aug 2022 |
| Utility: Selective deposition using hydrolysis Filling date: 6 Sep 2025 Issue date: 2 Aug 2022 | 1 Mar 2019 | 2 Aug 2022 |
| Utility: Etching isolation features and dense features within a substrate Filling date: 6 Sep 2025 Issue date: 26 Jul 2022 | 22 Nov 2019 | 26 Jul 2022 |
| Utility: Wafer transport assembly with integrated buffers Filling date: 6 Sep 2025 Issue date: 19 Jul 2022 | 18 Sep 2020 | 19 Jul 2022 |
| Utility: Systems and methods for controlling plasma instability in semiconductor fabrication Filling date: 6 Sep 2025 Issue date: 19 Jul 2022 | 27 Nov 2019 | 19 Jul 2022 |
| Utility: Pad raising mechanism in wafer positioning pedestal for semiconductor processing Filling date: 6 Sep 2025 Issue date: 12 Jul 2022 | 4 Feb 2020 | 12 Jul 2022 |
| Utility: Method for conditioning a ceramic coating Filling date: 6 Sep 2025 Issue date: 12 Jul 2022 | 1 Jul 2019 | 12 Jul 2022 |
| Utility: Thermal atomic layer etch with rapid temperature cycling Filling date: 6 Sep 2025 Issue date: 5 Jul 2022 | 24 Nov 2020 | 5 Jul 2022 |
| Utility: Surface modified depth controlled deposition for plasma based deposition Filling date: 6 Sep 2025 Issue date: 28 Jun 2022 | 24 Jul 2020 | 28 Jun 2022 |
| Utility: Ex situ coating of chamber components for semiconductor processing Filling date: 6 Sep 2025 Issue date: 21 Jun 2022 | 22 Jul 2020 | 21 Jun 2022 |
| Utility: Adjustment of power and frequency based on three or more states Filling date: 6 Sep 2025 Issue date: 14 Jun 2022 | 13 Apr 2020 | 14 Jun 2022 |
| Utility: Thermal imaging for within wafer variability feedforward or feedback information Filling date: 6 Sep 2025 Issue date: 7 Jun 2022 | 26 Feb 2021 | 7 Jun 2022 |
| Utility: Method for preventing line bending during metal fill process Filling date: 6 Sep 2025 Issue date: 7 Jun 2022 | 21 Dec 2019 | 7 Jun 2022 |
| Utility: Tin oxide mandrels in patterning Filling date: 6 Sep 2025 Issue date: 7 Jun 2022 | 29 Jan 2019 | 7 Jun 2022 |
| Utility: Metal fill process for three-dimensional vertical NAND wordline Filling date: 6 Sep 2025 Issue date: 31 May 2022 | 10 Aug 2018 | 31 May 2022 |
| Utility: Confinement ring for use in a plasma processing system Filling date: 6 Sep 2025 Issue date: 24 May 2022 | 11 Jun 2020 | 24 May 2022 |
| Utility: Variable depth edge ring for etch uniformity control Filling date: 6 Sep 2025 Issue date: 24 May 2022 | 11 May 2020 | 24 May 2022 |
| Utility: RF pulsing within pulsing for semiconductor RF plasma processing Filling date: 6 Sep 2025 Issue date: 24 May 2022 | 28 Nov 2018 | 24 May 2022 |
| Utility: Systems and methods for optimizing power delivery to an electrode of a plasma chamber Filling date: 6 Sep 2025 Issue date: 17 May 2022 | 28 Sep 2018 | 17 May 2022 |
| Utility: Systems and methods for reducing effluent build-up in a pumping exhaust system Filling date: 6 Sep 2025 Issue date: 17 May 2022 | 13 Sep 2016 | 17 May 2022 |
| Utility: Controller for controlling core critical dimension variation using flash trim sequence Filling date: 6 Sep 2025 Issue date: 3 May 2022 | 21 Jul 2020 | 3 May 2022 |
| Utility: Tin oxide films in semiconductor device manufacturing Filling date: 6 Sep 2025 Issue date: 3 May 2022 | 18 Nov 2019 | 3 May 2022 |
| Utility: Underlayer for photoresist adhesion and dose reduction Filling date: 6 Sep 2025 Issue date: 26 Apr 2022 | 11 Jan 2021 | 26 Apr 2022 |
| Utility: Apparatus for spatial and temporal control of temperature on a substrate Filling date: 6 Sep 2025 Issue date: 12 Apr 2022 | 13 Apr 2020 | 12 Apr 2022 |
| Utility: Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching Filling date: 6 Sep 2025 Issue date: 5 Apr 2022 | 11 Jul 2018 | 5 Apr 2022 |
| Utility: Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching Filling date: 6 Sep 2025 Issue date: 29 Mar 2022 | 2 Jun 2020 | 29 Mar 2022 |
| Utility: Ion beam etching utilizing cryogenic wafer temperatures Filling date: 6 Sep 2025 Issue date: 29 Mar 2022 | 21 Aug 2017 | 29 Mar 2022 |
| Utility: Electrostatic chuck for use in semiconductor processing Filling date: 6 Sep 2025 Issue date: 29 Mar 2022 | 2 Jun 2017 | 29 Mar 2022 |
| Utility: Removal of electroplating bath additives Filling date: 6 Sep 2025 Issue date: 22 Mar 2022 | 16 Jun 2020 | 22 Mar 2022 |
| Utility: Moving substrate transfer chamber Filling date: 6 Sep 2025 Issue date: 22 Mar 2022 | 15 Feb 2019 | 22 Mar 2022 |
| Utility: Plasma processing system having an inspection tool and controller that interfaces with a tool model Filling date: 6 Sep 2025 Issue date: 15 Mar 2022 | 23 Apr 2019 | 15 Mar 2022 |
| Utility: Apparatus for UV flowable dielectric Filling date: 6 Sep 2025 Issue date: 8 Mar 2022 | 11 Jul 2019 | 8 Mar 2022 |
| Utility: Etching carbon layer using doped carbon as a hard mask Filling date: 6 Sep 2025 Issue date: 8 Mar 2022 | 14 Dec 2018 | 8 Mar 2022 |
| Utility: Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal Filling date: 6 Sep 2025 Issue date: 1 Mar 2022 | 22 Apr 2020 | 1 Mar 2022 |
| Utility: Defect classification and source analysis for semiconductor equipment Filling date: 6 Sep 2025 Issue date: 1 Mar 2022 | 10 Jan 2019 | 1 Mar 2022 |
| Utility: Eliminating yield impact of stochastics in lithography Filling date: 6 Sep 2025 Issue date: 22 Feb 2022 | 31 Aug 2020 | 22 Feb 2022 |
| Utility: Mutually induced filters Filling date: 6 Sep 2025 Issue date: 22 Feb 2022 | 30 Mar 2020 | 22 Feb 2022 |
