Amkor Technology
Patents, Design & Utilities
Last updated:
List of all Amkor Technology patents 157 in total
| Status | Patent |
|---|---|
Application | Utility: SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS Filling date: 6 Sep 2025 Issue date: 24 Sep 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 24 Sep 2020 |
Grant | Utility: Semiconductor package and fabricating method thereof Filling date: 6 Sep 2025 Issue date: 22 Sep 2020 |
Grant | Utility: Semiconductor device with optically-transmissive layer and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 22 Sep 2020 |
Grant | Utility: Wafer-level stack chip package and method of manufacturing the same Filling date: 6 Sep 2025 Issue date: 22 Sep 2020 |
Application | Utility: SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 17 Sep 2020 |
Application | Utility: SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 17 Sep 2020 |
Grant | Utility: System and method for laser assisted bonding of an electronic device Filling date: 6 Sep 2025 Issue date: 1 Sep 2020 |
Application | Utility: METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME Filling date: 6 Sep 2025 Issue date: 27 Aug 2020 |
Grant | Utility: Semiconductor device with tiered pillar and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 18 Aug 2020 |
Application | Utility: METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY Filling date: 6 Sep 2025 Issue date: 6 Aug 2020 |
Grant | Utility: Method and system for packing optimization of semiconductor devices Filling date: 6 Sep 2025 Issue date: 4 Aug 2020 |
Application | Utility: Semiconductor Package With EMI Shield and Fabricating Method Thereof Filling date: 6 Sep 2025 Issue date: 30 Jul 2020 |
Application | Utility: METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY Filling date: 6 Sep 2025 Issue date: 16 Jul 2020 |
Application | Utility: SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 16 Jul 2020 |
Grant | Utility: Semiconductor device package and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 14 Jul 2020 |
Grant | Utility: Semiconductor devices and methods of making semiconductor devices Filling date: 6 Sep 2025 Issue date: 14 Jul 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF Filling date: 6 Sep 2025 Issue date: 9 Jul 2020 |
Application | Utility: FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 9 Jul 2020 |
Application | Utility: FINE PITCH COPPER PILLAR PACKAGE AND METHOD Filling date: 6 Sep 2025 Issue date: 9 Jul 2020 |
Grant | Utility: Semiconductor device with redistribution layers formed utilizing dummy substrates Filling date: 6 Sep 2025 Issue date: 7 Jul 2020 |
Application | Utility: SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 25 Jun 2020 |
Grant | Utility: Electronic device package and fabricating method thereof Filling date: 6 Sep 2025 Issue date: 23 Jun 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 18 Jun 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Filling date: 6 Sep 2025 Issue date: 18 Jun 2020 |
Grant | Utility: Semiconductor package having routable encapsulated conductive substrate and method Filling date: 6 Sep 2025 Issue date: 16 Jun 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 11 Jun 2020 |
Application | Utility: SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 11 Jun 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 11 Jun 2020 |
Grant | Utility: Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 9 Jun 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF Filling date: 6 Sep 2025 Issue date: 4 Jun 2020 |
Grant | Utility: Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Filling date: 6 Sep 2025 Issue date: 2 Jun 2020 |
Grant | Utility: Semiconductor package with high routing density patch Filling date: 6 Sep 2025 Issue date: 2 Jun 2020 |
Grant | Utility: Sensor package and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 2 Jun 2020 |
Grant | Utility: Semiconductor package using cavity substrate and manufacturing methods Filling date: 6 Sep 2025 Issue date: 2 Jun 2020 |
Grant | Utility: Wafer level package and fabrication method Filling date: 6 Sep 2025 Issue date: 26 May 2020 |
Application | Utility: PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING STRUCTURE Filling date: 6 Sep 2025 Issue date: 14 May 2020 |
Application | Utility: METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED WETTABLE FLANK AND STRUCTURE Filling date: 6 Sep 2025 Issue date: 7 May 2020 |
Grant | Utility: Semiconductor device and method of manufacturing a semiconductor device Filling date: 6 Sep 2025 Issue date: 5 May 2020 |
Grant | Utility: Packaging for fingerprint sensors and methods of manufacture Filling date: 6 Sep 2025 Issue date: 28 Apr 2020 |
Application | Utility: SEMICONDUCTOR DEVICE WITH AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD Filling date: 6 Sep 2025 Issue date: 23 Apr 2020 |
Application | Utility: CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING Filling date: 6 Sep 2025 Issue date: 23 Apr 2020 |
Grant | Utility: Method of manufacturing an electronic device and electronic device manufactured thereby Filling date: 6 Sep 2025 Issue date: 24 Mar 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 12 Mar 2020 |
Application | Utility: SEMICONDUCTOR DEVICE WITH IMPROVED THERMAL DISSIPATION AND MANUFACTURING METHODS Filling date: 6 Sep 2025 Issue date: 12 Mar 2020 |
Grant | Utility: Semiconductor package and fabricating method thereof Filling date: 6 Sep 2025 Issue date: 10 Mar 2020 |
Grant | Utility: Packaging for fingerprint sensors and methods of manufacture Filling date: 6 Sep 2025 Issue date: 3 Mar 2020 |
Application | Utility: ENCAPSULATED SEMICONDUCTOR PACKAGE Filling date: 6 Sep 2025 Issue date: 27 Feb 2020 |
Grant | Utility: Packaged electronic device having integrated antenna and locking structure Filling date: 6 Sep 2025 Issue date: 18 Feb 2020 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 13 Feb 2020 |
Showing 50 to 100 of 157 patents.