Amkor Technology
Patents, Design & Utilities
Last updated:
List of all Amkor Technology patents 157 in total
| Status | Patent |
|---|---|
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 6 Feb 2020 |
Grant | Utility: Semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 4 Feb 2020 |
Grant | Utility: Semiconductor package with EMI shield and fabricating method thereof Filling date: 6 Sep 2025 Issue date: 4 Feb 2020 |
Grant | Utility: Stackable via package and method Filling date: 6 Sep 2025 Issue date: 28 Jan 2020 |
Grant | Utility: Method of forming a plurality of electronic component packages Filling date: 6 Sep 2025 Issue date: 28 Jan 2020 |
Application | Utility: SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND METHOD FOR MANUFACTURING THEREOF Filling date: 6 Sep 2025 Issue date: 16 Jan 2020 |
Grant | Utility: Stiffener package and method of fabricating stiffener package Filling date: 6 Sep 2025 Issue date: 14 Jan 2020 |
Grant | Utility: Semiconductor package and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 14 Jan 2020 |
Application | Utility: SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS Filling date: 6 Sep 2025 Issue date: 9 Jan 2020 |
Grant | Utility: Method of forming a packaged semiconductor device having enhanced wettable flank and structure Filling date: 6 Sep 2025 Issue date: 7 Jan 2020 |
Application | Utility: SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 2 Jan 2020 |
Application | Utility: ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 26 Dec 2019 |
Grant | Utility: Semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 24 Dec 2019 |
Grant | Utility: Semiconductor package structure for improving die warpage and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 10 Dec 2019 |
Grant | Utility: Semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 10 Dec 2019 |
Grant | Utility: Semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 10 Dec 2019 |
Application | Utility: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Filling date: 6 Sep 2025 Issue date: 5 Dec 2019 |
Application | Utility: SHIELDED ELECTRONIC COMPONENT PACKAGE Filling date: 6 Sep 2025 Issue date: 5 Dec 2019 |
Application | Utility: METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES Filling date: 6 Sep 2025 Issue date: 5 Dec 2019 |
Grant | Utility: Semiconductor package and fabricating method thereof Filling date: 6 Sep 2025 Issue date: 3 Dec 2019 |
Grant | Utility: Semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 3 Dec 2019 |
Grant | Utility: Semiconductor package having inspection structure and related methods Filling date: 6 Sep 2025 Issue date: 26 Nov 2019 |
Grant | Utility: Semiconductor device with optically-transmissive layer and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 26 Nov 2019 |
Grant | Utility: Semiconductor device and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 19 Nov 2019 |
Application | Utility: THIN BONDED INTERPOSER PACKAGE Filling date: 6 Sep 2025 Issue date: 14 Nov 2019 |
Grant | Utility: Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof Filling date: 6 Sep 2025 Issue date: 12 Nov 2019 |
Application | Utility: STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE Filling date: 6 Sep 2025 Issue date: 7 Nov 2019 |
Grant | Utility: Method of manufacturing an electronic device and electronic device manufactured thereby Filling date: 6 Sep 2025 Issue date: 5 Nov 2019 |
Grant | Utility: Method for fabricating semiconductor package and semiconductor package using the same Filling date: 6 Sep 2025 Issue date: 5 Nov 2019 |
Grant | Utility: Encapsulated semiconductor package Filling date: 6 Sep 2025 Issue date: 29 Oct 2019 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 24 Oct 2019 |
Application | Utility: SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 24 Oct 2019 |
Application | Utility: SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS Filling date: 6 Sep 2025 Issue date: 17 Oct 2019 |
Grant | Utility: Fingerprint sensor and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 15 Oct 2019 |
Application | Utility: SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS Filling date: 6 Sep 2025 Issue date: 10 Oct 2019 |
Application | Utility: Method of Manufacturing a Package-on-Package Type Semiconductor Package Filling date: 6 Sep 2025 Issue date: 10 Oct 2019 |
Grant | Utility: Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof Filling date: 6 Sep 2025 Issue date: 8 Oct 2019 |
Application | Utility: EMBEDDED BALL LAND SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHODS Filling date: 6 Sep 2025 Issue date: 3 Oct 2019 |
Application | Utility: ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 3 Oct 2019 |
Grant | Utility: Shielded electronic component package Filling date: 6 Sep 2025 Issue date: 24 Sep 2019 |
Application | Utility: ENCAPSULATED SEMICONDUCTOR PACKAGE Filling date: 6 Sep 2025 Issue date: 19 Sep 2019 |
Application | Utility: SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE Filling date: 6 Sep 2025 Issue date: 19 Sep 2019 |
Grant | Utility: Fine pitch copper pillar package and method Filling date: 6 Sep 2025 Issue date: 17 Sep 2019 |
Application | Utility: ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 12 Sep 2019 |
Application | Utility: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Filling date: 6 Sep 2025 Issue date: 12 Sep 2019 |
Application | Utility: SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS Filling date: 6 Sep 2025 Issue date: 12 Sep 2019 |
Grant | Utility: Manufacturing method of semiconductor device and semiconductor device thereof Filling date: 6 Sep 2025 Issue date: 10 Sep 2019 |
Grant | Utility: Semiconductor device and method of manufacturing thereof Filling date: 6 Sep 2025 Issue date: 10 Sep 2019 |
Grant | Utility: Electronic device comprising a conductive pad on a protruding-through electrode Filling date: 6 Sep 2025 Issue date: 10 Sep 2019 |
Grant | Utility: Semiconductor device with integrated heat distribution and manufacturing method thereof Filling date: 6 Sep 2025 Issue date: 10 Sep 2019 |
Showing 100 to 150 of 157 patents.