| Utility: Semiconductor package and fabricating method thereof Filling date: 8 Sep 2025 Issue date: 10 Mar 2020 | 5 Dec 2017 | 10 Mar 2020 |
| Utility: Packaging for fingerprint sensors and methods of manufacture Filling date: 8 Sep 2025 Issue date: 3 Mar 2020 | 11 Jul 2017 | 3 Mar 2020 |
| Utility: Packaged electronic device having integrated antenna and locking structure Filling date: 8 Sep 2025 Issue date: 18 Feb 2020 | 3 Mar 2018 | 18 Feb 2020 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 4 Feb 2020 | 25 Jun 2018 | 4 Feb 2020 |
| Utility: Semiconductor package with EMI shield and fabricating method thereof Filling date: 8 Sep 2025 Issue date: 4 Feb 2020 | 12 Jan 2017 | 4 Feb 2020 |
| Utility: Stackable via package and method Filling date: 8 Sep 2025 Issue date: 28 Jan 2020 | 11 Feb 2019 | 28 Jan 2020 |
| Utility: Method of forming a plurality of electronic component packages Filling date: 8 Sep 2025 Issue date: 28 Jan 2020 | 27 Jun 2017 | 28 Jan 2020 |
| Utility: Stiffener package and method of fabricating stiffener package Filling date: 8 Sep 2025 Issue date: 14 Jan 2020 | 5 Mar 2019 | 14 Jan 2020 |
| Utility: Semiconductor package and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 14 Jan 2020 | 27 Mar 2018 | 14 Jan 2020 |
| Utility: Method of forming a packaged semiconductor device having enhanced wettable flank and structure Filling date: 8 Sep 2025 Issue date: 7 Jan 2020 | 21 Dec 2018 | 7 Jan 2020 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 24 Dec 2019 | 18 Sep 2018 | 24 Dec 2019 |
| Utility: Semiconductor package structure for improving die warpage and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 10 Dec 2019 | 13 Mar 2018 | 10 Dec 2019 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 10 Dec 2019 | 11 Dec 2017 | 10 Dec 2019 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 10 Dec 2019 | 3 Jun 2016 | 10 Dec 2019 |
| Utility: Semiconductor package and fabricating method thereof Filling date: 8 Sep 2025 Issue date: 3 Dec 2019 | 7 Dec 2018 | 3 Dec 2019 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 3 Dec 2019 | 13 Apr 2017 | 3 Dec 2019 |
| Utility: Semiconductor package having inspection structure and related methods Filling date: 8 Sep 2025 Issue date: 26 Nov 2019 | 21 Dec 2018 | 26 Nov 2019 |
| Utility: Semiconductor device with optically-transmissive layer and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 26 Nov 2019 | 6 Apr 2018 | 26 Nov 2019 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 19 Nov 2019 | 19 Dec 2016 | 19 Nov 2019 |
| Utility: Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof Filling date: 8 Sep 2025 Issue date: 12 Nov 2019 | 28 Feb 2017 | 12 Nov 2019 |
| Utility: Method of manufacturing an electronic device and electronic device manufactured thereby Filling date: 8 Sep 2025 Issue date: 5 Nov 2019 | 26 Feb 2018 | 5 Nov 2019 |
| Utility: Method for fabricating semiconductor package and semiconductor package using the same Filling date: 8 Sep 2025 Issue date: 5 Nov 2019 | 18 Jan 2018 | 5 Nov 2019 |
| Utility: Encapsulated semiconductor package Filling date: 8 Sep 2025 Issue date: 29 Oct 2019 | 23 Dec 2014 | 29 Oct 2019 |
| Utility: Fingerprint sensor and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 15 Oct 2019 | 10 May 2017 | 15 Oct 2019 |
| Utility: Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof Filling date: 8 Sep 2025 Issue date: 8 Oct 2019 | 21 Dec 2016 | 8 Oct 2019 |
| Utility: Shielded electronic component package Filling date: 8 Sep 2025 Issue date: 24 Sep 2019 | 15 Aug 2016 | 24 Sep 2019 |
| Utility: Fine pitch copper pillar package and method Filling date: 8 Sep 2025 Issue date: 17 Sep 2019 | 14 Feb 2019 | 17 Sep 2019 |
| Utility: Manufacturing method of semiconductor device and semiconductor device thereof Filling date: 8 Sep 2025 Issue date: 10 Sep 2019 | 21 Aug 2018 | 10 Sep 2019 |
| Utility: Semiconductor device and method of manufacturing thereof Filling date: 8 Sep 2025 Issue date: 10 Sep 2019 | 2 Aug 2018 | 10 Sep 2019 |
| Utility: Electronic device comprising a conductive pad on a protruding-through electrode Filling date: 8 Sep 2025 Issue date: 10 Sep 2019 | 13 Apr 2018 | 10 Sep 2019 |
| Utility: Semiconductor device with integrated heat distribution and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 10 Sep 2019 | 19 Dec 2017 | 10 Sep 2019 |
| Utility: Semiconductor device and manufacturing method thereof Filling date: 8 Sep 2025 Issue date: 20 Aug 2019 | 5 Apr 2018 | 20 Aug 2019 |
| Utility: Semiconductor device using EMC wafer support system and fabricating method thereof Filling date: 8 Sep 2025 Issue date: 20 Aug 2019 | 18 Apr 2017 | 20 Aug 2019 |
| Utility: Method of manufacturing a semiconductor device and interconnection structures thereof Filling date: 8 Sep 2025 Issue date: 20 Aug 2019 | 26 Aug 2015 | 20 Aug 2019 |
| Utility: Semiconductor device and method of manufacturing a semiconductor device Filling date: 8 Sep 2025 Issue date: 13 Aug 2019 | 20 Nov 2018 | 13 Aug 2019 |
| Utility: Packaged electronic device having stepped conductive structure and related methods Filling date: 8 Sep 2025 Issue date: 30 Jul 2019 | 16 Sep 2017 | 30 Jul 2019 |
