Lam Research
Patents, Design & Utilities
Last updated:
List of all Lam Research patents 221 in total
| Status | Patent |
|---|---|
Grant | Utility: Copper electrodeposition on cobalt lined features Filling date: 13 Sep 2025 Issue date: 9 Nov 2021 |
Grant | Design: Semiconductor wafer processing tool Filling date: 13 Sep 2025 Issue date: 9 Nov 2021 |
Grant | Utility: Method for etching an etch layer Filling date: 13 Sep 2025 Issue date: 9 Nov 2021 |
Grant | Utility: Internal plasma grid for semiconductor fabrication Filling date: 13 Sep 2025 Issue date: 9 Nov 2021 |
Application | Utility: ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL Filling date: 13 Sep 2025 Issue date: 4 Nov 2021 |
Application | Utility: QUARTZ COMPONENT WITH PROTECTIVE COATING Filling date: 13 Sep 2025 Issue date: 4 Nov 2021 |
Application | Utility: METHOD TO CREATE AIR GAPS Filling date: 13 Sep 2025 Issue date: 4 Nov 2021 |
Application | Utility: IN SITU PROTECTIVE COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING Filling date: 13 Sep 2025 Issue date: 4 Nov 2021 |
Application | Utility: APPARATUS FOR AN INERT ANODE PLATING CELL Filling date: 13 Sep 2025 Issue date: 4 Nov 2021 |
Application | Utility: METHOD FOR CONDITIONING A PLASMA PROCESSING CHAMBER Filling date: 13 Sep 2025 Issue date: 4 Nov 2021 |
Application | Utility: METHOD AND APPARATUS FOR MEASURING PARTICLES Filling date: 13 Sep 2025 Issue date: 4 Nov 2021 |
Application | Utility: PROTECTIVE COATING FOR ELECTROSTATIC CHUCKS Filling date: 13 Sep 2025 Issue date: 28 Oct 2021 |
Application | Utility: ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES Filling date: 13 Sep 2025 Issue date: 28 Oct 2021 |
Application | Utility: METHOD FOR ETCHING AN ETCH LAYER Filling date: 13 Sep 2025 Issue date: 28 Oct 2021 |
Application | Utility: CONTINUOUS PLASMA FOR FILM DEPOSITION AND SURFACE TREATMENT Filling date: 13 Sep 2025 Issue date: 28 Oct 2021 |
Application | Utility: SELECTIVELY ETCHING FOR NANOWIRES Filling date: 13 Sep 2025 Issue date: 28 Oct 2021 |
Application | Utility: METAL CONTAMINATION REDUCTION IN SUBSTRATE PROCESSING SYSTEMS WITH TRANSFORMER COUPLED PLASMA Filling date: 13 Sep 2025 Issue date: 21 Oct 2021 |
Application | Utility: FILL ON DEMAND AMPOULE REFILL Filling date: 13 Sep 2025 Issue date: 21 Oct 2021 |
Application | Utility: Multiple-Output Radiofrequency Matching Module and Associated Methods Filling date: 13 Sep 2025 Issue date: 7 Oct 2021 |
Application | Utility: SYSTEMS AND METHODS FOR ACHIEVING PEAK ION ENERGY ENHANCEMENT WITH A LOW ANGULAR SPREAD Filling date: 13 Sep 2025 Issue date: 7 Oct 2021 |
Application | Utility: ETCHING METAL-OXIDE AND PROTECTING CHAMBER COMPONENTS Filling date: 13 Sep 2025 Issue date: 7 Oct 2021 |
Application | Utility: RF POWER COMPENSATION TO REDUCE DEPOSITION OR ETCH RATE CHANGES IN RESPONSE TO SUBSTRATE BULK RESISTIVITY VARIATIONS Filling date: 13 Sep 2025 Issue date: 7 Oct 2021 |
Application | Utility: MULTI-LAYER FEATURE FILL Filling date: 13 Sep 2025 Issue date: 7 Oct 2021 |
Application | Utility: ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL Filling date: 13 Sep 2025 Issue date: 30 Sep 2021 |
Application | Utility: INDUCTIVELY COUPLED PLASMA CHAMBER HEATER FOR CONTROLLING DIELECTRIC WINDOW TEMPERATURE Filling date: 13 Sep 2025 Issue date: 30 Sep 2021 |
Application | Utility: RF SIGNAL PARAMETER MEASUREMENT IN AN INTEGRATED CIRCUIT FABRICATION CHAMBER Filling date: 13 Sep 2025 Issue date: 30 Sep 2021 |
Grant | Utility: Gapfill of variable aspect ratio features with a composite PEALD and PECVD method Filling date: 13 Sep 2025 Issue date: 28 Sep 2021 |
Grant | Utility: Apparatus for thermal control of tubing assembly and associated methods Filling date: 13 Sep 2025 Issue date: 28 Sep 2021 |
Grant | Utility: Ceramic baseplate with channels having non-square corners Filling date: 13 Sep 2025 Issue date: 28 Sep 2021 |
Application | Utility: ELECTROSTATIC CHUCK DESIGN FOR COOLING-GAS LIGHT-UP PREVENTION Filling date: 13 Sep 2025 Issue date: 23 Sep 2021 |
Application | Utility: SURFACE COATING FOR PLASMA PROCESSING CHAMBER COMPONENTS Filling date: 13 Sep 2025 Issue date: 23 Sep 2021 |
Grant | Utility: Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity Filling date: 13 Sep 2025 Issue date: 21 Sep 2021 |
Grant | Utility: Peripheral RF feed and symmetric RF return for symmetric RF delivery Filling date: 13 Sep 2025 Issue date: 21 Sep 2021 |
Grant | Utility: Split chamber assembly Filling date: 13 Sep 2025 Issue date: 21 Sep 2021 |
Grant | Utility: Method to selectively pattern a surface for plasma resistant coat applications Filling date: 13 Sep 2025 Issue date: 21 Sep 2021 |
Application | Utility: INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCH CHAMBER AND IN-SITU ETCH-ALP METHOD Filling date: 13 Sep 2025 Issue date: 16 Sep 2021 |
Application | Utility: ELECTRON EXCITATION ATOMIC LAYER ETCH Filling date: 13 Sep 2025 Issue date: 9 Sep 2021 |
Application | Utility: METHOD FOR CONDITIONING A CERAMIC COATING Filling date: 13 Sep 2025 Issue date: 9 Sep 2021 |
Grant | Utility: Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region Filling date: 13 Sep 2025 Issue date: 7 Sep 2021 |
Grant | Utility: Systems for removing and replacing consumable parts from a semiconductor process module in situ Filling date: 13 Sep 2025 Issue date: 7 Sep 2021 |
Application | Utility: INTEGRATED SHOWERHEAD WITH IMPROVED HOLE PATTERN FOR DELIVERING RADICAL AND PRECURSOR GAS TO A DOWNSTREAM CHAMBER TO ENABLE REMOTE PLASMA FILM DEPOSITION Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: THERMAL IMAGING FOR WITHIN WAFER VARIABILITY FEEDFORWARD OR FEEDBACK INFORMATION Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: SELECTIVELY ETCHING FOR NANOWIRES Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: DYNAMIC TEMPERATURE CONTROL OF SUBSTRATE SUPPORT IN SUBSTRATE PROCESSING SYSTEM Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: OXIDATIVE CONVERSION IN ATOMIC LAYER DEPOSITION PROCESSES Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: REDUCED FOOTPRINT WAFER HANDLING PLATFORM Filling date: 13 Sep 2025 Issue date: 2 Sep 2021 |
Application | Utility: TIN OXIDE MANDRELS IN PATTERNING Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Application | Utility: TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Application | Utility: TEMPERATURE-TUNED SUBSTRATE SUPPORT FOR SUBSTRATE PROCESSING SYSTEMS Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Application | Utility: METHOD AND APPARATUS FOR PROCESSING WAFERS Filling date: 13 Sep 2025 Issue date: 26 Aug 2021 |
Showing 150 to 200 of 221 patents.