| Utility: Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching Filling date: 6 Sep 2025 Issue date: 29 Mar 2022 | 2 Jun 2020 | 29 Mar 2022 |
| Utility: Ion beam etching utilizing cryogenic wafer temperatures Filling date: 6 Sep 2025 Issue date: 29 Mar 2022 | 21 Aug 2017 | 29 Mar 2022 |
| Utility: Electrostatic chuck for use in semiconductor processing Filling date: 6 Sep 2025 Issue date: 29 Mar 2022 | 2 Jun 2017 | 29 Mar 2022 |
| Utility: Removal of electroplating bath additives Filling date: 6 Sep 2025 Issue date: 22 Mar 2022 | 16 Jun 2020 | 22 Mar 2022 |
| Utility: Moving substrate transfer chamber Filling date: 6 Sep 2025 Issue date: 22 Mar 2022 | 15 Feb 2019 | 22 Mar 2022 |
| Utility: SYSTEMS AND METHODS FOR FILTERING RADIO FREQUENCIES FROM A SIGNAL OF A THERMOCOUPLE AND CONTROLLING A TEMPERATURE OF AN ELECTRODE IN A PLASMA CHAMBER Filling date: 6 Sep 2025 Issue date: 17 Mar 2022 | 29 Nov 2021 | 17 Mar 2022 |
| Utility: Plasma processing system having an inspection tool and controller that interfaces with a tool model Filling date: 6 Sep 2025 Issue date: 15 Mar 2022 | 23 Apr 2019 | 15 Mar 2022 |
| Utility: Apparatus for UV flowable dielectric Filling date: 6 Sep 2025 Issue date: 8 Mar 2022 | 11 Jul 2019 | 8 Mar 2022 |
| Utility: Etching carbon layer using doped carbon as a hard mask Filling date: 6 Sep 2025 Issue date: 8 Mar 2022 | 14 Dec 2018 | 8 Mar 2022 |
| Utility: RESISTIVE RANDOM ACCESS MEMORY WITH PREFORMED FILAMENTS Filling date: 6 Sep 2025 Issue date: 3 Mar 2022 | 13 Jan 2020 | 3 Mar 2022 |
| Utility: LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELECTROSTATIC CHUCK WITH MULTIPLEXED HEATERS ARRAY Filling date: 6 Sep 2025 Issue date: 3 Mar 2022 | 4 Dec 2019 | 3 Mar 2022 |
| Utility: Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal Filling date: 6 Sep 2025 Issue date: 1 Mar 2022 | 22 Apr 2020 | 1 Mar 2022 |
| Utility: Defect classification and source analysis for semiconductor equipment Filling date: 6 Sep 2025 Issue date: 1 Mar 2022 | 10 Jan 2019 | 1 Mar 2022 |
| Utility: GAPFILL OF VARIABLE ASPECT RATIO FEATURES WITH A COMPOSITE PEALD AND PECVD METHOD Filling date: 6 Sep 2025 Issue date: 24 Feb 2022 | 2 Sep 2021 | 24 Feb 2022 |
| Utility: Eliminating yield impact of stochastics in lithography Filling date: 6 Sep 2025 Issue date: 22 Feb 2022 | 31 Aug 2020 | 22 Feb 2022 |
| Utility: Mutually induced filters Filling date: 6 Sep 2025 Issue date: 22 Feb 2022 | 30 Mar 2020 | 22 Feb 2022 |
| Utility: Combiner and distributor for adjusting impedances or power across multiple plasma processing stations Filling date: 6 Sep 2025 Issue date: 22 Feb 2022 | 21 Feb 2020 | 22 Feb 2022 |
| Utility: Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system Filling date: 6 Sep 2025 Issue date: 22 Feb 2022 | 28 Jun 2019 | 22 Feb 2022 |
| Utility: CONTROL OF WAFER BOW IN MULTIPLE STATIONS Filling date: 6 Sep 2025 Issue date: 17 Feb 2022 | 29 Oct 2021 | 17 Feb 2022 |
| Utility: UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION Filling date: 6 Sep 2025 Issue date: 10 Feb 2022 | 26 Oct 2021 | 10 Feb 2022 |
| Utility: RF TUNING SYSTEMS INCLUDING TUNING CIRCUITS HAVING IMPEDANCES FOR SETTING AND ADJUSTING PARAMETERS OF ELECTRODES IN ELECTROSTATIC CHUCKS Filling date: 6 Sep 2025 Issue date: 10 Feb 2022 | 22 Oct 2021 | 10 Feb 2022 |
| Utility: MAGNETIC SHIELDING FOR PLASMA SOURCES Filling date: 6 Sep 2025 Issue date: 10 Feb 2022 | 20 Oct 2021 | 10 Feb 2022 |
| Utility: INTEGRATED TOOL LIFT Filling date: 6 Sep 2025 Issue date: 10 Feb 2022 | 21 Feb 2020 | 10 Feb 2022 |
| Utility: DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION Filling date: 6 Sep 2025 Issue date: 3 Feb 2022 | 20 Oct 2021 | 3 Feb 2022 |
| Utility: PROGRESSIVE HEATING OF COMPONENTS OF SUBSTRATE PROCESSING SYSTEMS USING TCR ELEMENT-BASED HEATERS Filling date: 6 Sep 2025 Issue date: 3 Feb 2022 | 19 Oct 2021 | 3 Feb 2022 |
| Utility: UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION Filling date: 6 Sep 2025 Issue date: 3 Feb 2022 | 11 Jan 2021 | 3 Feb 2022 |
| Utility: ANOMALOUS PLASMA EVENT DETECTION AND MITIGATION IN SEMICONDUCTOR PROCESSING Filling date: 6 Sep 2025 Issue date: 3 Feb 2022 | 7 Feb 2020 | 3 Feb 2022 |
| Utility: REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER Filling date: 6 Sep 2025 Issue date: 3 Feb 2022 | 3 Oct 2019 | 3 Feb 2022 |
| Utility: LOW-K ALD GAP-FILL METHODS AND MATERIAL Filling date: 6 Sep 2025 Issue date: 3 Feb 2022 | 20 Sep 2019 | 3 Feb 2022 |
| Utility: Auto-calibration to a station of a process module that spins a wafer Filling date: 6 Sep 2025 Issue date: 1 Feb 2022 | 8 May 2020 | 1 Feb 2022 |
| Utility: Conformal damage-free encapsulation of chalcogenide materials Filling date: 6 Sep 2025 Issue date: 1 Feb 2022 | 24 Aug 2018 | 1 Feb 2022 |
| Utility: ENHANCED AUTOMATIC WAFER CENTERING SYSTEM AND TECHNIQUES FOR SAME Filling date: 6 Sep 2025 Issue date: 27 Jan 2022 | 31 Oct 2019 | 27 Jan 2022 |
| Utility: Actuator to adjust dynamically showerhead tilt in a semiconductor-processing apparatus Filling date: 6 Sep 2025 Issue date: 25 Jan 2022 | 12 Dec 2019 | 25 Jan 2022 |
| Utility: PLASMA PROCESSING CHAMBER Filling date: 6 Sep 2025 Issue date: 6 Jan 2022 | 27 Sep 2019 | 6 Jan 2022 |
| Utility: Systems and methods for filtering radio frequencies from a signal of a thermocouple and controlling a temperature of an electrode in a plasma chamber Filling date: 6 Sep 2025 Issue date: 30 Nov 2021 | 24 Jul 2019 | 30 Nov 2021 |
| Utility: Magnetic shielding for plasma sources Filling date: 6 Sep 2025 Issue date: 16 Nov 2021 | 25 Jul 2018 | 16 Nov 2021 |
| Utility: MECHANICAL INDEXER FOR MULTI-STATION PROCESS MODULE Filling date: 6 Sep 2025 Issue date: 14 Oct 2021 | 3 May 2021 | 14 Oct 2021 |
| Utility: NITRIDE FILMS WITH IMPROVED ETCH SELECTIVITY FOR 3D NAND INTEGRATION Filling date: 6 Sep 2025 Issue date: 14 Oct 2021 | 8 Oct 2019 | 14 Oct 2021 |
| Utility: SYSTEMS AND METHODS FOR OPTIMIZING POWER DELIVERY TO AN ELECTRODE OF A PLASMA CHAMBER Filling date: 6 Sep 2025 Issue date: 14 Oct 2021 | 28 Sep 2018 | 14 Oct 2021 |
| Utility: Systems and methods for UV-based suppression of plasma instability Filling date: 6 Sep 2025 Issue date: 14 Sep 2021 | 5 Dec 2019 | 14 Sep 2021 |
| Utility: Selective growth of metal-containing hardmask thin films Filling date: 6 Sep 2025 Issue date: 31 Aug 2021 | 30 Mar 2020 | 31 Aug 2021 |
| Utility: Selective deposition of etch-stop layer for enhanced patterning Filling date: 6 Sep 2025 Issue date: 17 Aug 2021 | 15 Jan 2020 | 17 Aug 2021 |
| Utility: Components and Processes for Managing Plasma Process Byproduct Materials Filling date: 6 Sep 2025 Issue date: 22 Jul 2021 | 7 Jan 2019 | 22 Jul 2021 |
| Utility: Atomic layer etch of tungsten for enhanced tungsten deposition fill Filling date: 6 Sep 2025 Issue date: 20 Jul 2021 | 26 May 2020 | 20 Jul 2021 |
| Utility: In situ vapor deposition polymerization to form polymers as precursors to viscoelastic fluids for particle removal from substrates Filling date: 6 Sep 2025 Issue date: 20 Jul 2021 | 25 Jun 2018 | 20 Jul 2021 |
| Utility: Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity Filling date: 6 Sep 2025 Issue date: 20 Jul 2021 | 27 Jun 2017 | 20 Jul 2021 |
| Utility: METHOD OF ETCH MODEL CALIBRATION USING OPTICAL SCATTEROMETRY Filling date: 6 Sep 2025 Issue date: 15 Jul 2021 | 31 Mar 2021 | 15 Jul 2021 |
| Utility: Ion injector and lens system for ion beam milling Filling date: 6 Sep 2025 Issue date: 13 Jul 2021 | 25 Jan 2018 | 13 Jul 2021 |
| Utility: Metal doped carbon based hard mask removal in semiconductor fabrication Filling date: 6 Sep 2025 Issue date: 13 Jul 2021 | 30 Jun 2017 | 13 Jul 2021 |
| Utility: Showerhead Faceplate Having Flow Apertures Configured for Hollow Cathode Discharge Suppression Filling date: 6 Sep 2025 Issue date: 8 Jul 2021 | 24 Mar 2021 | 8 Jul 2021 |
